DBLC24CIQ

Document number: DS45446 Rev. 1 - 2

2 of 5

www.diodes.com

May 2024

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DBLC24CIQ

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Conditions

Peak Pulse Power Dissipation

PPP

350

W

8/20

μs, Per Figure 3

Peak Pulse Current

IPP

6

A

8/20

μs, Per Figure 3

ESD Protection

– Contact Discharge

VESD_CONTACT

±25

kV

Standard IEC 61000-4-2

ESD Protection

– Air Discharge

VESD_AIR

±30

kV

Standard IEC 61000-4-2

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Package Power Dissipation (Note 5)

PD

250

mW

Thermal Resistance, Junction to Ambient (Note 5)

RJA

500

C/W

Operating Temperature Range

TJ

-55 to +150

C

Storage Temperature Range

TSTG

-55 to +150

C

Soldering Temperature, t max = 10s

TL

+260

C

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Conditions

Reverse Working Voltage

VRWM

—

—

24

V

—

Reverse Current (Note 6)

IR

—

—

1

μA

VR = VRWM = 24V

Reverse Breakdown Voltage

VBR

26.7

—

—

V

IR = 1mA

Reverse Clamping Voltage

VCL

—

—

43

V

IPP = 1A, tP = 8/20μs

—

—

58

IPP = 6A, tP = 8/20μs

Capacitance

CIN

—

0.6

0.7

pF

VR = 0V, f = 1MHz

Notes:

5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown in Diodes

Incorporated’s package outline PDFs, which can be found on our website at

http://www.diodes.com/package-outlines.html.

6. Short duration pulse test used to minimize self-heating effect.

10

100

1000

10000

1

10

100

1000

Figure 1. ESD Pulse Waveform According to IEC 61000-4-2

Figure 2. Power Dissipation Versus Pulse Time

PULSE TIMES (

μs)

Time (ns)

TJ = 25°C, tP = 8/20μs

Exponentially Decay Waveform