© Semiconductor Components Industries, LLC, 2019

August, 2020 − Rev. 0

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Publication Order Number:

ESDM2033/D

ESD Protection Diodes

Micro−packaged Diodes for ESD

Protection

ESDM2033

The ESDM2033 is designed to protect voltage sensitive components

from ESD. Excellent clamping capability, low leakage, and fast

response time provide best in class protection on designs that are

exposed to ESD. Because of its small size, it is suited for use in

smartphone, smart-watch, or many other portable / wearable

applications where board space comes at a premium.

Features

• Low Capacitance (5.5 pF Max, I/O to GND)

• Small Body Outline Dimensions

♦ 0.6 x 0.3 mm

• Protection for the Following IEC Standards:

IEC 61000−4−2 (Level 4)

• Low ESD Clamping Voltage

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol

Value

Unit

Operating Junction Temperature Range

TJ

−55 to +125

°C

Storage Temperature Range

Tstg

−55 to +150

°C

Lead Solder Temperature −

Maximum (10 Seconds)

TL

260

°C

IEC 61000−4−2 Contact (ESD)

IEC 61000−4−2 Air (ESD)

ESD

ESD

±15

±15

kV

kV

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

See Application Note AND8308/D for further description of

survivability specs.

PIN CONFIGURATION

AND SCHEMATIC

www.onsemi.com

12

=

See detailed ordering and shipping information on page 2 of

this data sheet.

ORDERING INFORMATION

X4DFN2

(0201)

CASE 152AX

MARKING

DIAGRAM

P

= Specific Device Code

P