© 2007 Microchip Technology Inc.

DS21615C-page 9

TCM811/TCM812

4-Lead Plastic Small Outline Transistor (RC) [SOT-143]

Notes:

1. § Significant Characteristic.

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

4

Pitch

e

1.92 BSC

Pin1 Offset

e1

0.20 BSC

Overall Height

A

0.80

–

1.22

Molded Package Thickness

A2

0.75

0.90

1.07

Standoff §

A1

0.01

–

0.15

Overall Width

E

2.10

–

2.64

Molded Package Width

E1

1.20

1.30

1.40

Overall Length

D

2.67

2.90

3.05

Foot Length

L

0.13

0.50

0.60

Footprint

L1

0.54 REF

Foot Angle

φ

0°

–

8°

Lead Thickness

c

0.08

–

0.20

Lead 1 Width

b1

0.76

–

0.94

Leads 2, 3 & 4 Width

b

0.30

–

0.54

D

e

e/2

N

E

E1

2

1

e1

A

A1

b2

A2

3X

b

c

L

L1

φ

Microchip Technology Drawing C04-031B