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Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2
φ CA（K）or CC（T）at soldering portion（copper foil surface）.A heat resisting tape
should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
E
D
Time (s)
C
Pre-heating
F max.
Room
temperature
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. As the conditions vary some how depending on the kind of reflow soldering equipment, please make sure you have
the right one before use.
Notes
Series
（Reflow type）
SPPB
250
260
200
230
230
40
20
40
180
150
120
SPVN
260
SPVE
SPVG
SPPW8
SPVM
SPVR
250
SPVP
SSCM
SPPY5
240
20
150
Room
Temperature
180
SPVL
A
（℃）
3s max.
B
（℃）
C
（s）
D
（℃）
E
（℃）
F
（s）
Detector
306
Power
Push
Slide
Rotary
Encoders
Dual-in-line
Package Type
Multi Control
Devices
TACT
Custom-
Products
Detector Switches
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