AD8074/AD8075

Rev. B

OUTLINE DIMENSIONS

16

9

8

1

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 1. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8074ARU

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

AD8074ARUZ

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

AD8074ARUZ-REEL

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

AD8074ARUZ-REEL7

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

AD8075ARUZ

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

AD8075ARUZ-REEL

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

AD8075ARUZ-REEL7

−40°C to +85°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

AD8074Z-EVAL

Evaluation Board

AD8075Z-EVAL

Evaluation Board

1 Z = RoHS Compliant Part.

REVISION HISTORY

10/11—Rev. A to Rev. B

Changes to Ordering Guide...........................................................15

10/01—Rev. 0 to Rev. A

Changes to Single-Supply Operation Section................................9

©2001–2011 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D02391-0-10/11(B)

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