AM27C1024 datasheet(6/12 Pages) AMD

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Am27C1024

connection to all devices in the array and connected to

the READ line from the system control bus. This as-

sures that all deselected memory devices are in their

low-power standby mode and that the output pins are

only active when data is desired from a particular mem-

ory device.

System Applications

During the switch between active and standby condi-

tions, transient current peaks are produced on the ris-

ing and falling edges of Chip Enable. The magnitude of

these transient current peaks is dependent on the out-

put capacitance loading of the device. At a minimum, a

0.1 µF ceramic capacitor (high frequency, low inherent

inductance) should be used on each device between

VCC and VSS to minimize transient effects. In addition,

to overcome the voltage drop caused by the inductive

effects of the printed circuit board traces on EPROM ar-

rays, a 4.7 µF bulk electrolytic capacitor should be used

between VCC and VSS for each eight devices. The loca-

tion of the capacitor should be close to where the

power supply is connected to the array.

MODE SELECT TABLE

Notes:

1. VH = 12.0 V ± 0.5 V.

2. X = Either VIH or VIL.

3. A1–A8 and A10–15 = VIL

4. See DC Programming Characteristics for VPP voltage during programming.

Mode

CE#

OE#

PGM#

VPP

Outputs

Read

VIL

DOUT

Output Disable

VIH

High Z

Standby (TTL)

VIH

High Z

Standby (CMOS)

VCC ± 0.3 V

High Z

Program

VIL

XVIL

VPP

DIN

Program Verify

VIL

VIH

VPP

DOUT

Program Inhibit

VIH

VPP

High Z

Autoselect

(Note 3)

Manufacturer Code

VIL

VIH

VIL

X01h

Device Code

VIL

VIH

X8Ch

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