2009072319210055

MP8706 – SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS

MP8706 Rev. 0.91

www.MonolithicPower.com

2

7/20/2009

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

© 2009 MPS. All Rights Reserved.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Temperature

MP8706EN

SOIC8E

MP8706EN

–20

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP8706EN–Z). For RoHS Compliant Packaging, add suffix –LF (e.g.

MP8706EN–LF–Z)

PACKAGE REFERENCE

IN

SW

SW

BST

GND

VCC

FB

EN/SYNC

1

2

3

4

8

7

6

5

TOP VIEW

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ....................................... 24V

VSW........................-0.3V (-5V for < 10ns) to 25V

VBS ....................................................... VSW + 6V

All Other Pins.................................–0.3V to +6V

Operating Temperature.............. -20

°C to +85°C

Continuous Power Dissipation (TA = +25°C)

(2)

……………………………………………....2.5W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.5V to 21V

Operating Temperature............. –20

°C to +85°C

Thermal Resistance

(4)

θJA

θJC

SOIC8E (Exposed Pad).......... 50 ...... 10...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.