9.2 Documentation Support

9.2.1 Related Documentation

The following documents are relevant to using the TLVx365, and recommended for reference. All are available

for download at www.ti.com unless otherwise noted.

• Texas Instruments, FilterPro™ software user's guide

• Texas Instruments, Low Power Input and Reference Driver Circuit for ADS8318 and ADS8319 application

report

• Texas Instruments, Op Amp Performance Analysis application bulletin

• Texas Instruments, Single-Supply Operation of Operational Amplifiers application bulletin

• Texas Instruments, The Best of Baker's Best – Amplifiers eBook reference book

9.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.5 Trademarks

TINA-TI™, FilterPro™, and TI E2E™ are trademarks of Texas Instruments.

TINA™ is a trademark of DesignSoft, Inc.

PSpice® is a registered trademark of Cadence Design Systems, Inc.

All trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (September 2023) to Revision C (August 2024)

Page

• Added TLV2365 DGK package to data sheet.....................................................................................................1

• Updated offset drift spec of TLVx365................................................................................................................. 2

• Updated input offset voltage drift typical and maximum value........................................................................... 5

• Added CMRR minimum value for room temperature......................................................................................... 5

• Deleted AOL minimum values across temperature and added typical values ....................................................5

• Updated Device Functional Modes ..................................................................................................................13

• Updated Power Supply Recommendations .....................................................................................................17

TLV365, TLV2365

SBOSAA8C – DECEMBER 2022 – REVISED AUGUST 2024

www.ti.com

20

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Product Folder Links: TLV365 TLV2365