5.3 Thermal Information

THERMAL METRIC(1)

TLV185x/6x

UNIT

DBV

(SOT-23)

DGK

(VSSOP)

PW

(TSSOP)

5 Pins

8 Pins

14 Pins

RqJA

Junction-to-ambient thermal resistance

168.1

163.1

94.2

°C/W

RqJC(top)

Junction-to-case (top) thermal resistance

68.1

55.5

29

°C/W

RqJB

Junction-to-board thermal resistance

37.4

84.7

51.8

°C/W

yJT

Junction-to-top characterization parameter

11.4

5.7

1.3

°C/W

yJB

Junction-to-board characterization parameter

37.1

83.1

51.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

1.8

40

V

Input voltage range from (V–)

–0.1

40

V

Common-mode input voltage range from (V–)

0

40

V

Output voltage for open drain from (V–)

–0.1

40

V

Ambient temperature, TA

–40

125

°C

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SNOSDE7B – DECEMBER 2022 – REVISED SEPTEMBER 2024

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