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TZA3014HT Datasheet(PDF) 18 Page - NXP Semiconductors |
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TZA3014HT Datasheet(HTML) 18 Page - NXP Semiconductors |
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18 / 28 page ![]() 2001 Jun 25 18 Philips Semiconductors Product specification 2.5 Gbits/s postamplifier with level detector TZA3014 APPLICATION INFORMATION RF input and output connections Striplines, or microstrips, with an odd mode characteristic impedance of Zo =50 Ω have to be used for the differential RF connections on the PCB. This applies to both signal inputs and signal outputs. Each pair of lines should have the same length. Grounding and power supply decoupling The PCB ground connection has to be a large area of copper connected to a common ground plane with an inductance as low as possible. To minimize low frequency switching noise in the vicinity of the TZA3014, the power supply line should be filtered once using a beaded capacitor circuit having a low cut-off frequency. The exposed die pad GNDp connection on the PCB must be a large area of copper to aid the transfer of heat from the IC to the PCB (see Figs 11 and 12). |
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