AD8506

Preliminary Technical Data

Rev. PrA | Page 10 of 10

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-187-AA

0.80

0.60

0.40

8°

0°

4

8

1

5

PIN 1

0.65 BSC

SEATING

PLANE

0.38

0.22

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.08

3.20

3.00

2.80

5.15

4.90

4.65

0.15

0.00

0.95

0.85

0.75

Figure 8. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

SEATING

PLANE

0.50

BALL PITCH

1.480

1.430

1.380

1.825

1.775

1.725

0.27

0.24

0.21

0.380

0.355

0.330

0.340

0.320

0.300

0.675

0.595

0.515

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

A

1

2

3

B

C

BALL 1

IDENTIFIER

Figure 9. 8-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-8-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

–40°C to +125°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

–40°C to +125°C

8-Ball Wafer Level Chip Scale Package [WLCSP]

CB-8-1

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registered trademarks are the property of their respective owners.

PR06900-0-8/07(PrA)