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PIMXRT805VXAF4A Datasheet(PDF) 20 Page - NXP Semiconductors

Part # PIMXRT805VXAF4A
Description  i.MX RT1060 Crossover Processors for Consumer Products
PDF  119 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PIMXRT805VXAF4A Datasheet(HTML) 20 Page - NXP Semiconductors

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i.MX RT1060 Crossover Processors for Consumer Products, Rev. 4, 04/2024
20
NXP Semiconductors
Modules List
3.1
Special signal considerations
Table 3 lists special signal considerations for the i.MX RT1060 processors. The signal names are listed in
alphabetical order.
The package contact assignments can be found in Section 6, Package information and contact
assignments.” Signal descriptions are provided in the i.MX RT1060 Reference Manual
(IMXRT1060RM).
Table 3. Special signal considerations
Signal Name
Remarks
CCM_CLK1_P/
CCM_CLK1_N
One general purpose differential high speed clock Input/output (LVDS I/O) is provided.
It can be used:
• To feed external reference clock to the PLLs and further to the modules inside SoC.
• To output internal SoC clock to be used outside the SoC as either reference clock or as a
functional clock for peripherals.
See the i.MX RT1060 Reference Manual (IMXRT1060RM) for details on the respective clock trees.
Alternatively one may use single ended signal to drive CLK1_P input. In this case corresponding
CLK1_N input should be tied to the constant voltage level equal 1/2 of the input signal swing.
Termination should be provided in case of high frequency signals.
After initialization, the CLK1 input/output can be disabled (if not used). If unused either or both of
the CLK1_N/P pairs may remain unconnected.
DCDC_PSWITCH
PAD is in DCDC_IN domain and connected the ground to bypass DCDC.
To enable DCDC function, assert to DCDC_IN with at least 1ms delay for DCDC_IN rising edge.
RTC_XTALI/RTC_XTALO If the user wishes to configure RTC_XTALI and RTC_XTALO as an RTC oscillator, a 32.768 kHz
crystal, (100 k ESR, 10 pF load) should be connected between RTC_XTALI and RTC_XTALO.
Keep in mind the capacitors implemented on either side of the crystal are about twice the crystal
load capacitor. To hit the exact oscillation frequency, the board capacitors need to be reduced to
account for board and chip parasitics. The integrated oscillation amplifier is self biasing, but
relatively weak. Care must be taken to limit parasitic leakage from RTC_XTALI and RTC_XTALO
to either power or ground (>100 M). This will debias the amplifier and cause a reduction of startup
margin. Typically RTC_XTALI and RTC_XTALO should bias to approximately 0.5 V.
If it is desired to feed an external low frequency clock into RTC_XTALI the RTC_XTALO pin must
remain unconnected or driven with a complimentary signal. The logic level of this forcing clock
should not exceed VDD_SNVS_CAP level and the frequency should be <100 kHz under typical
conditions.
In case when high accuracy real time clock are not required system may use internal low frequency
ring oscillator. It is recommended to connect RTC_XTALI to GND and keep RTC_XTALO
unconnected.
XTALI/XTALO
A 24.0 MHz crystal should be connected between XTALI and XTALO.
The crystal must be rated for a maximum drive level of 250 W. An ESR (equivalent series
resistance) of typical 80  is recommended. NXP SDK software requires 24 MHz on
XTALI/XTALO.
The crystal can be eliminated if an external 24 MHz oscillator is available in the system. In this
case, XTALO must be directly driven by the external oscillator and XTALI mounted with 18 pF
capacitor. The logic level of this forcing clock cannot exceed NVCC_PLL level.
If this clock is used as a reference for USB, then there are strict frequency tolerance and jitter
requirements. See OSC24M chapter and relevant interface specifications chapters for details.
GPANAIO
This signal is reserved for NXP manufacturing use only. This output must remain unconnected.



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