C

500

0

25

50

75

100

125

150

FIG.1

OUTPUT CURRENT vs AMBIENT TEMPERATURE

FIG.2

NON-REPETITIVE SURGE CURRENT RATINGS

RVF

FIG.3

PACKAGE STYLE

21 GRAY OAKS AVENUE

* YONKERS. NEW YORK 10710 914-965-4400

* FAX 914-965-5531

* 1-800-678-0828

AMBIENT TEMP

O

( C )

A

*

_

+

L

B

TEST CIRCUIT

FIG.4

TYPICAL REVERSE RECOVERY WAVEFORM

PULSE

GENERATOR

D.U.T.

SCOPE

R

2

1 OHM

R1

50 OHM

-

175

400

300

200

100

600

E

D

LTR

A

B

C

D

E

INCHES

MILLIMETERS

.051 DIA.

+

_ .03

+

_ . 7 6

1.30 DIA.

0.31 MAX.

0.76 MAX.

2.0 MIN.

19.30 MAX.

7.9 MAX.

50.8 MIN.

Prior to the manufacture of these assemblies, the individual silicon junction is measured for

maximum recovery time in the test circuit shown.

RVF 5-15

RVF 20-40

100

75

50

25

0

1

2

3

4

9 10

20

30

40 50 60

8

CYCLES(60 Hz)

0.1SEC

1.0SEC

1.0A

0.5A

T RR

ZERO

REFERENCE

0.25A

R R

1, 2 NON-INDUCTIVE RESISTORS

PULSE GENERATOR - HEWLETT

PACKARD 214A OR EQUIV.

IKC REP.RATE, 10 SEC. PULSE WIDTH

ADJUST PULSE AMPLITUDE FOR PEAK IR

It is recommended that a proper heat sink be used on the terminals of this device between the body and the soldering point to

prevent damage form excess heat.