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TMP175-Q1, TMP75-Q1

SBOS759 – NOVEMBER 2015

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Typical Application (continued)

8.2.2 Detailed Design Procedure

Place the TMP175-Q1 and TMP75-Q1 devices in close proximity to the heat source that must be monitored, with

a proper layout for good thermal coupling. This placement ensures that temperature changes are captured within

the shortest possible time interval. To maintain accuracy in applications that require air or surface temperature

measurement, take care to isolate the package and leads from ambient air temperature. A thermally-conductive

adhesive is helpful in achieving accurate surface temperature measurement.

8.2.3 Application Curve

Figure 14 shows the step response of the TMP175-Q1 and TMP75-Q1 devices to a submersion in an oil bath of

100ºC from room temperature (27ºC). The time-constant, or the time for the output to reach 63% of the input

step, is 1.5 s. The time-constant result depends on the PCB where the TMPx175 devices are mounted. For this

test, the TMP175-Q1 and TMP75-Q1 devices were soldered to a two-layer PCB that measured 0.375 inches ×

0.437 inches.

Figure 14. Temperature Step Response

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