PCA9674 datasheet(29/34 Pages) PHILIPS

29 / 34 page

PCA9674_PCA9674A_2

Product data sheet

Rev. 02 — 12 October 2006

29 of 34

NXP Semiconductors

PCA9674/74A

Remote 8-bit I/O expander for Fm+ I2C-bus with interrupt

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 10 and 11

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 29.

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”.

Table 10.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm)

Package reﬂow temperature (

°C)

Volume (mm3)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

Table 11.

Lead-free process (from J-STD-020C)

Package thickness (mm)

Package reﬂow temperature (

°C)

Volume (mm3)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

MSL: Moisture Sensitivity Level

Fig 29. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

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