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MICRF112 Datasheet(PDF) 38 Page - Microchip Technology |
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MICRF112 Datasheet(HTML) 38 Page - Microchip Technology |
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38 / 46 page ![]() MICRF112 Package Information Data Sheet © 2024 Microchip Technology Inc. and its subsidiaries DS70005554A - 38 Microchip Technology Drawing No. C04-03081 Rev A 10-Lead Plastic Micro Small Outline Package (DQA)- 3x3x1.0 mm Body [MSOP] RECOMMENDED LAND PATTERN BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units C Contact Pad Spacing Overall Width Contact Pitch Z MILLIMETERS 0.50 BSC MIN E MAX 4.40 6.06 Contact Pad Length (X10) Contact Pad Width (X10) Y1 X1 1.28 0.32 G Distance Between Pads (X8) 0.20 NOM Distance Between Pads (X5) G1 3.00 E C Z G1 X1 G Y1 SILK SCREEN © 2023 Microchip Technology Inc. 0.30 0.28 1.26 1.24 |
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