PIIPM50E06D004 datasheet(12/28 Pages) IRF

12 / 28 page

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PIIPM50P12B004

I27146 01/03

The new package outline is show on page 4, all

signal and power pins are clearly listed, note that

because of high current spikes on those inputs the

DC bus power pins are doubled in size

comparing to the other power pins. Module

technology uses the standard and well know

DBC: over a thick Copper base an allumina

(Al2O3) substrate with a 300

µm copper foil on

both side is placed and IGBTs and Diodes dies

are directly soldered, through screen printing

process. These dies are then bonded with a 15

mils aluminum wire for power and signal

connections. All components are then completely

covered by a silicone gel with mechanical

protection and electrical isolation purposes.

THE “EDB” EMBEDDED DRIVING BOARD

This is the core of the device intelligence, all

control and driving functions are implemented at

this level, the board finds its natural placement as

a cover of the module itself and has a double

function of mechanical cover and intelligent

interface. DSP and all other electronics are here

assembled; figure on page 2 shows the board

schematic and all connection pins.

Looking at the schematic, all diamond shaped

pins are signal connections, some belonging to

the RS422 port interface and some to the IEEE

1149.1 (JTAG) connector. All other pins are used

for communication between the board and the

module, they are positioned laterally in the board

and the module doesn’t have any pins in the

middle of its body.

From the top left, in anti-clockwise direction we

identify the following blocks that will be then

described in details:

DSP and opto isolated serial and JTAG

ports

Flyback Power Supply

Current Sensing interfaces, over-current

protections and signal conditioning

Gate drivers

DC bus and Input voltage feedback

1. DSP and opto isolated serial and JTAG

ports.

The DSP used in this application is the new

TMS320LF2406A from TI, it is a improvement

of the well known in the motor driver market

“F240” used in many motor driver applications.

If we compare this new device with the

predecessor, the new DSP has some added

features

that

let

the

software

designer

significantly

improve

the

system

control

performances, the following table shows a list of

relevant data, for all other information please

refer to the related device datasheet. To be noted

is the increased number of instruction per second,

(40MIPS) and of I/O pins, the availability of a

boot ROM and a CAN, a much faster ADC and

the reduced supply voltage from 5V down to

3.3V, to follow the global trend for this type of

products. The choice of the DSP has been done

looking at the high number of applications

already existing in the market using devices of

this family, however it is clear that the same kind

of approach could be followed using products

from different suppliers to let the customer work

on its preferred and well known platform.

TMS320LF2406A vs TMS320F240

‘F2406

‘F240

MIPS

RAM

Flash

ROM

Boot ROM

Ext. Memory I/F

Event manager

• GP timers

• CMP/PWM

• CAP/QEP

Watchdog timer

10-bit ADC

• Channels

• Conv. time (min)

SPI

SCI

CAN

Digital I/O pins

Voltage range

2.5Kw

32Kw

—

256w

—

Yes

10/16

6/4

Yes

500ns

Yes

3.3V

544w

16Kw

—

Yes

9/12

4/2

Yes

6.6

µs

Yes

—

5 V

PIIPM50E06D004 Datasheet(PDF) 12 Page - International Rectifier

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