data sheet

MQFP

Features:

Thermal Resistance:

Electrical:

Reliability:

LEADFRAME

www.amkor.com

Metric Quad Flat

Pack (MQFP)

Packages:

Amkor’s MQFP package portfolio enables

the designer, specifier or systems engineer

the flexibility of growing or shrinking IC

package size based upon application need.

Amkor employs the most up-to-date,

advanced equipment, material and

processes to assure successful, reliable

performance of your IC chips. Having a

complete line of MQFPs available and at

your disposal means security and conven-

ience. Sourcing them from Amkor means

success.

Thermal

Enhancement:

Some designs and applications require an

added margin of thermal performance

(power). Amkor’s easy and cost-effective

solution is a heatspreader. This optional

embedded thermal aid improves Theta JA

by greater than 15% (without external

heatsinks or fans) by increasing the heat

dissipation path from the IC chip to the

PCB.

Applications:

Amkor’s MQFP line is adapted to meet the

increasing challenges of advancing proces-

sors/controllers, DSP, ASIC, video-DAC, PC

chip-sets, gate arrays, logic, multi-media

and other technologies. These packages fill

many end application needs in consumer,

commercial, office, automotive, PC, indus-

trial and other product areas.

Amkor’s MQFP IC package portfolio provides:

• 10 x 10 mm to 40 x 40 mm body size

• 44 to 304 lead counts

• Hi-conductivity copper leadframes

• Die up and down configurations

• JEDEC standard compliant

• Wide selection of leadframe die pad sizes

• Integrated thermal enhancement

• Heatspreader available

• Custom leadframe design available

• Fine pitch wire bond capability

• Lead free option available

Multi-Layer PCB

Body

Theta JA (°C/W) by Velocity (LFPM)

Pkg

Size (mm)

Pad Size

0

200

500

44 ld

10 x 10

7.4 x 7.4

38.4

32.1

29.4

64 ld

14 x 14

8.9 x 8.9

33.7

27.9

25.5

JEDEC Standard Test Boards

Multi-Layer PCB

Body

Theta JA (°C/W) by Velocity (LFPM)

Pkg

Size (mm)

Pad Size

0

200

500

**44 ld

10 x 10

7.4 x 7.4

37.5

31.8

29.4

**64 ld

14 x 14

8.9 x 8.9

32.7

27.4

25.1

*100 ld

14 x 20

11.0 x 11.0

27.3

23.5

21.6

*208 ld

28 x 28

11.0 x 11.0

25.7

22.6

20.9

*240 ld

32 x 32

12.7 x 12.7

24.5

21.8

20.5

*304 ld

40 x 40

11.0 x 11.0

26.8

24.0

22.5

* Pre-JEDEC Standard Test Boards

** JEDEC Standard Test Boards

Body Size

Inductance

Capacitance

Resistance

Pkg

(mm)

Lead

(nH)

(pF)

(mΩ)

44 ld 10 x 10 Longest

1.660

0.322

19.8

Shortest

1.460

0.342

17.0

Simulated Results @ 100 MHz

Amkor’s MQFPs are reliability assured through optimized design, material

and process enabling high performance operation of your IC chip.

• Moisture Sensitivity

JEDEC Level 3

Characterization

30 °C/60% RH, 192 hours

• PCT

121 °C /100% RH/2 atm., 504 hours

• Temp cycle

-65/+150 °C, 1000 cycles

• Temp/Humidity

85 °C/85% RH, 1000 hours

• High temp storage

150 °C, 1000 hours

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

.

DS250G

Rev Date: 09’02