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LM324D Datasheet(PDF) 32 Page - Texas Instruments |
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LM324D Datasheet(HTML) 32 Page - Texas Instruments |
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32 / 64 page ![]() www.ti.com PACKAGE OUTLINE C 16X 0.30 0.18 1.68 0.07 16X 0.5 0.3 0.8 MAX (DIM A) TYP 0.05 0.00 12X 0.5 4X 1.5 A 3.1 2.9 B 3.1 2.9 WQFN - 0.8 mm max height RTE0016C PLASTIC QUAD FLATPACK - NO LEAD 4219117/B 04/2022 SIDE WALL METAL THICKNESS DIM A OPTION 1 OPTION 2 0.1 0.2 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 4 9 12 5 8 16 13 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD 17 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.600 LM124, LM124A, LM224, LM224A, LM224K, LM224KA LM324, LM324A, LM324B, LM324BA, LM324K, LM324KA LM2902, LM2902B, LM2902BA, LM2902K, LM2902KV, LM2902KAV SLOS066AD – SEPTEMBER 1975 – REVISED OCTOBER 2024 www.ti.com 32 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: LM124 LM124A LM224 LM224A LM224K LM224KA LM324 LM324A LM324B LM324BA LM324K LM324KA LM2902 LM2902B LM2902BA LM2902K LM2902KV LM2902KAV |
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