TMUX1574DYYR datasheet(27/44 Pages) TI

27 / 44 page

Signal 1

GND Plane

Power Plane

Signal 2

WORST

BETTER

BEST

1W min.

TMUX1574

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SCDS391C – OCTOBER 2018 – REVISED DECEMBER 2019

Product Folder Links: TMUX1574

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11 Layout

11.1 Layout Guidelines

When a PCB trace turns a corner at a 90° angle, a reflection can occur. A reflection occurs primarily because of

the change of width of the trace. At the apex of the turn, the trace width increases to 1.414 times the width. This

increase upsets the transmission-line characteristics, especially the distributed capacitance and self–inductance

of the trace which results in the reflection. Not all PCB traces can be straight and therefore some traces must

turn corners.Figure 44 shows progressively better techniques of rounding corners. Only the last example (BEST)

maintains constant trace width and minimizes reflections.

Figure 44. Trace Example

Route the high-speed signals using a minimum of vias and corners which reduces signal reflections and

impedance changes. When a via must be used, increase the clearance size around it to minimize its

capacitance. Each via introduces discontinuities in the signal’s transmission line and increases the chance of

picking up interference from the other layers of the board. Be careful when designing test points, through-

hole pins are not recommended at high frequencies.

Do not route high speed signal traces under or near crystals, oscillators, clock signal generators, switching

regulators, mounting holes, magnetic devices or ICs that use or duplicate clock signals.

Avoid stubs on the high-speed signals traces because they cause signal reflections.

Route all high-speed signal traces over continuous GND planes, with no interruptions.

Avoid crossing over anti-etch, commonly found with plane splits.

When working with high frequencies, a printed circuit board with at least four layers is recommended; two

signal layers separated by a ground and power layer as shown in Figure 45.

Figure 45. Example Layout

The majority of signal traces must run on a single layer, preferably Signal 1. Immediately next to this layer must

be the GND plane, which is solid with no cuts. Avoid running signal traces across a split in the ground or power

plane. When running across split planes is unavoidable, sufficient decoupling must be used. Minimizing the

number of signal vias reduces EMI by reducing inductance at high frequencies.

Figure 46 illustrates an example of a PCB layout with the TMUX1574. Some key considerations are:

TMUX1574DYYR Datasheet(PDF) 27 Page - Texas Instruments