Reliability Qualification

Amkor assures reliable performance by continuously monitoring key

indices:

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Moisture sensitivity characterization: JEDEC level 3 @ 260°C, L2 & L1

achievable in some structures/BOMs*, 85°C/85% RH, 168 hours

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HAST: 130°C/85% RH, 96 hours

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Temp/Humidity: 85°C/85% RH, 1000 hours

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Temperature cycle: -55°C/+125°C, 1000 cycles

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High temperature storage: 150°C, 1000 hours

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Automotive AEC-Q100 grade 0 reliability available**

*Contact Amkor for additional information

**Board level reliability available

Body Size

(mm)

ΘJA at 1.0W and 0 Airflow (°C/W)

LFBGA

TFBGA

VFBGA

8 x 8

37.28

36.45

37.52

10 x 10

29.86

29.04

26.7

15 x 15

20.1

N/A

N/A

19 x 19

17.04

N/A

N/A

Thermal Performance (Standard BOM)

Thin core laminate (2 to 6 metal layer) from the strongest supply chain in

the industry, ultra-thin mold cap thickness and Si thinning to 50 μm enable

next-generation tablets, smartphones, game controllers, digital and video

cameras and remote devices.

Advances in substrate surface finishes and routing techniques reduce gold

costs while improving electrical and board level reliability performance.

Innovative thermal package structures offer cost competitive solutions for

the most challenging thermal management needs.

Applications

The ChipArray® package family is applicable for a wide range of

semiconductors from high end FPGAs, ASICS to memory, analog, RF devices,

MCUs and simple PLDs requiring a package size smaller than conv entional

PBGAs or leadframe packages. ChipArray® packages fill the need for the

low cost, minimum space, high performance and reliability requirements of

mobile and gaming devices, notebooks, personal computers, networking,

automotive and industrial applications.

Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages

are compatible with SMT mounting processes worldwide. The near

chip size CABGA fine-pitch BGA (FBGA) offers a broad selection of ball

array pitches (≥0.3 mm pitch), ball counts and body sizes (1.5 mm

to 27 mm body), single and multi-die layouts, stacked die (1-16) and

passive component integration.

ChipArray® CABGA/FBGA

DATA SHEET | LAMINATE PRODUCTS

FEATURES

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Cutting-edge technology and

expanding package offerings provide

a platform from prototype-to-

production

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Copper (Cu) wire interconnect method

and high-volume infrastructure at all

Amkor CABGA production facilities

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Lowest cost using Amkor standard

CABGA bill of materials selection

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1.5-27 mm body size available

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Square or rectangle packages

available

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4-700 ball/lead counts

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0.4, 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball

pitch available

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JEDEC publication 95 design guide 4.5

(JEP95)

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RoHS-6 (green) BOM options for 100%

of CABGA family

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Thermal conductivity epoxy (8 W/mk)

and thermal conductivity compound

(3 W/mK) are available