MQFP

Reliability Qualification

Amkor devices are assembled in optimized package

designs with proven reliable semiconductor materials.

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Moisture sensitivity characterization: JEDEC level 3,

30°C/60% RH, 192 hours

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Temp cycle: -65°C/+150°C, 1000 cycles

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Temp/Humidity: 85°C/85% RH, 1000 hours

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High temp storage: 150°C, 1000 hours

Process Highlights

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Die thickness: Target 18-20 mils (13 min to 25 max)

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Wirebond: 0.8 mil, 1.0 mil PCC Std

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Solder plating: Matte Sn

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Marking: Laser

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Lead inspection: Laser/optical

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Pack/Ship options: Barcode, dry pack

Test Services

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Program generation/conversion

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Product engineering support

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Wafer sort

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Final test

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Tri-temp test capability

Shipping

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JEDEC outline CS-004 low-profile tray

▷ Bakable (125°C and 150°C)

▷ Non-bakable

Cross Section MQFP

MQFP With Drop-In Al Heat Spreader

Standard MQFP

Cu leadframe

Die attach pad

Mold compound

A

B

Die

Die attach adhesive

Au or Cu wire

C

D

E

F

A

D

B

C

F

E

Cu leadframe

Die attach pad

Mold compound

Die

A

B

Die attach adhesive

Au or Cu wire

AI heat spreader

C

E

F

G

A

D

B

C

F

E

G

D