Features

Innovative designs and expanding package offerings provide a platform

from prototype-to-production.

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Custom ball counts up to 1521

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1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches

available upon request, e.g. 0.8 mm)

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17 to 40 mm body sizes

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Thin Au wire or Cu wire compatible

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Chip-on-Chip (CoC)

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Large mold cap for quality enhancement

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Low profile and lightweight

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Thermal and electrical enhancement capable

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Highly flexible internal routing of signal, power and ground for device

performance and system compatibility

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HDI designs possible

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Suitable substrate for multi-die (MCM) and integrated SMT structures

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Mature strip based manufacturing process with high yields

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Full in-house design capability

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Quickest design-to-prototype delivery

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Perimeter, stagger and full ball arrays

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Special packaging for memory available

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Multi-layer, ground/power

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JEDEC MS-034 standard outlines

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Excellent reliability

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63 Sn/37 Pb eutectic or Pb-free solder balls

Amkor’s PBGA/TEPBGA (Plastic Ball Grid Array/Thermally Enhanced

Plastic Ball Grid Array) packages incorporate the most advanced

assembly processes and designs for cost/performance applications.

This advanced IC package technology allows application and design

engineers to optimize innovations while maximizing the performance

characteristics of semiconductors.

These PBGA packages are designed for low inductance, improved

thermal operation and enhanced SMT ability. Custom performance

enhancements, like ground and power planes, are available for

significant improvements in electrical response demanded by

advanced electronics.

Additionally, these packages utilize industry proven, semiconductor

grade materials for reliable, long-term operations while providing

user flexible design parameters.

PBGA/TEPBGA

DATA SHEET | LAMINATE PRODUCTS