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R1211D103C Datasheet(PDF) 36 Page - RICOH electronics devices division |
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R1211D103C Datasheet(HTML) 36 Page - RICOH electronics devices division |
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36 / 40 page ![]() PACKAGE INFORMATION PE-SOT-23-6W-0512 POWER DISSIPATION (SOT-23-6W) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plactic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-hole φ0.5mm × 44pcs Measurement Result (Topt=25 °C,Tjmax=125°C) Standard Land Pattern Power Dissipation 430mW Thermal Resistance θja=(125−25°C)/0.43W=233°C/W 0 50 100 25 75 85 125 150 Ambient Temperature ( °C) 0 200 100 300 400 430 500 600 On Board 40 Power Dissipation Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN (SOT-23-6W) 0.7 MAX. 0.95 0.95 1.9 (Unit: mm) |
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