Reliability Qualification

Amkor package qualification uses three independent production lots and a

minimum of 77 units per test group. All testing includes JSTD‑020 moisture

preconditioning.

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Moisture sensitivity characterization

▷ 8L: JEDEC level 1, 85°C/85% RH, 168 hours

▷ Other than 8L: JEDEC level 3, 30°C/60% RH, 192 hours

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uHAST: 130°C/85% RH, no bias, 96 hours

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Temp cycle: ‑65°C/+150°C, 500 cycles

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High temp storage: 150°C, 1000 hours

SOIC (Small Outline IC Package) is a leadframe based, plastic

encapsulated package that is well suited for applications requiring

optimum performance in IC packaging. This industry standard

package runs in very‑high volume and provides value added, low‑cost

solutions for a wide range of applications.

SOIC

DATA SHEET | LEADFRAME PRODUCTS

Thermal Performance

Forced Convection, Single-Layer PCB

Package

Body Size

(mm)

Pad Size

(mm)

θJA at (°C/W) by Velocity (LFPM)

0

200

500

8 Ld

4.9 x 3.8

2.3 x 2.3

153.3

128.5

115.5

20 Ld

12.8 x 7.6

5.1 x 4.1

83.2

65.7

57.5

Forced Convection, Multi-Layer PCB

Package

Body Size

(mm)

Pad Size

(mm)

θJA at (°C/W) by Velocity (LFPM)

0

200

500

8 Ld

4.9 x 3.8

2.3 x 2.3

112.7

103.3

97.1

Pre‑JEDEC standard test boards

JEDEC standard test boards

Electrical Performance

Simulated Results @ 100 MHz

Package

Body Size

(mm)

Pad Size

(mm)

Lead

Inductance

(nH)

Capacitance

(pF)

Resistance

(mΩ)

8 Ld

4.9 x 3.8

3.6 x 2.3

Longest

1.25

0.263

8.2

–

–

–

Shortest

0.718

0.218

5.1

FEATURES

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Cu wire interconnect for low cost

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Standard JEDEC package outlines

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Multi‑die production capability

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Turnkey test services, including strip

test options

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Green materials are standard –

Pb‑free and RoHS compliant

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Stealth dicing (narrow saw streets)

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Larger/Higher density leadframe strips

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Leadframe roughening for improved

MSL capability

PROCESS HIGHLIGHTS

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Au plated PCC wire is standard,

Au and Ag wire available

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Wafer backgrinding services available

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Multiple die and die stacking capability

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NiPdAu (PPF) lead finish is standard,

matte Sn is optional

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Laser mark on package body