JEDEC standard test boards

Reliability Qualification

Amkor package qualification uses three independent production lots and a

minimum of 77 units per test group. All testing includes JSTD‑020 moisture

preconditioning.

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Moisture sensitivity characterization: JEDEC level 3, 30°C/60% RH,

192 hours

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uHAST: 130°C/85% RH, no bias, 96 hours

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Temp cycle: ‑65°C/+150°C, 500 cycles

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High temp storage: 150°C, 1000 hours

SSOP (Shrink Small‑Outline Package) and QSOP (Quarter‑Size Small

Outline Package) are leadframe based, plastic encapsulated packages

that are well suited for applications requiring optimum performance

in IC packaging with compressed body size and tightened lead pitch.

These industry standard IC packages yield a significant reduction in

size while running in high volume and provide value added, low‑cost

solutions for a wide range of applications.

SSOP/QSOP

DATA SHEET | LEADFRAME PRODUCTS

Thermal Performance

Forced Convection, Single-Layer PCB

Package

Body Size

(mm)

Pad Size

(mm)

θJA at (°C/W) by Velocity (LFPM)

0

200

500

20 Ld

3.9 x 8.7

2.4 x 3.6

80.8

73.2

69.2

28 Ld

5.3 x 10.2

3.84 x 8.10

49.0

36.0

30.0

Electrical Performance

Simulated Results @ 100 MHz

Package

Body Size

(mm)

Pad Size

(mm)

Lead

Inductance

(nH)

Bulk

Capacitance

(pF)

Self

Resistance

(mF)

20 Ld

5.3 x 7.2

3.9 x 5.4

Longest

Shortest

2.260

0.958

0.395

0.209

19.0

9.10

28 Ld

3.9 x 9.9

2.4 x 4.8

Longest

Shortest

1.590

0.757

0.376

0.198

14.1

7.53

28 Ld

5.3 x 10.2

3.9 x 5.1

Longest

Shortest

2.510

0.928

0.463

0.206

21.5

9.57

FEATURES

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Cu wire interconnect for low cost

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Standard JEDEC package outlines

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Multi‑die production capability

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Turnkey test services, including strip

test options

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Green materials are standard –

Pb‑free and RoHS compliant

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Stealth dicing (narrow saw streets)

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Larger/Higher density leadframe strips

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Leadframe roughening for improved

MSL capability

PROCESS HIGHLIGHTS

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Au plated PCC wire is standard,

Au and Ag wire available

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Wafer backgrinding services available

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Multiple die and die stacking capability

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NiPdAu (PPF) lead finish is standard,

matte Sn is optional

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Laser mark on package body