TS9007 datasheet(2/5 Pages) TSC

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TS9007 series

2-5

2006/02 rev. C

Absolute Maximum Rating

Supply Voltage

Vin

-0.3 ~ +7

Input Supply Voltage (Recommended)

Vopr

+2 ~ +6

Output Short-Circuit Duration

Infinite

Power Dissipation

380

Thermal Resistance

Өja

260

oC/W

Junction Temperature Range

+150

Storage Temperature Range

Tstg

-65 ~ +150

Lead Soldering Temperature (260

oC)

Caution

: Stress above the listed absolute rating may cause permanent damage to the device

Electrical Characteristics

Ta = 25

oC, Vin= (V

OUT+1V), Cin=Cout=0.47uF, Ven=Vin, unless otherwise specified.

Parameter

Conditions

Min

Typ

Max

Unit

Output Voltage

Vin =Vo + 1V, IO=10mA

-2.0

Output Current Limit

Short-circuit output

200

Maximum Output Current

Vin =Vo+1V,

300

Line Regulation

Vin=(VOUT+1V) to 6V, IO=10mA

0.3

%/V

Vin=Vo+1V,

1mA

≤IL≤300mA

Vout

≥2.5V

0.2

1.0

Load Regulation

Vin=Vo+1V,

1mA

≤IL≤200mA

Vout<2.5V

0.2

1.0

Io=300mA,

Vout=Vo - 2%

Vout

≥2.5V

500

600

Dropout Voltage

Io=200mA,

Vout=Vo - 2%

Vout<2.5V

800

1000

Shutdown Supply Current

EN=0V

0.01

Ground Pin Current

Io=0mA

150

f=100Hz, Io=1mA

f=1KHz, Io=1mA

Ripple Rejection (PSRR)

f=10kHz, Io=1mA

Io=10mA, f=10Hz to 100kHz,

Bypass = 0nF

Output Noise

Io=10mA, f=10Hz to 100kHz,

Bypass = 30nF

uVrms

Shutdown Exit Delay (note 2)

RLOAD = 50Ω

300

EN Logic Low Level

Vin=2.0V to 5.5V

0.4

EN Logic High Level

Vin=2.0V to 5.5V

1.5

VIN

EN Input Bias Current

Vin=2.0V to 5.5V

Thermal Shutdown

Shutdown Temperature

160

Thermal Shutdown Hysteresis

Note 1: The drop out voltage varies depending on output voltage selection

Dropout is defined as Vin - Vout when Vout is 100mV below Vout where Vin = Vout+1V for nominal Vout

Note 2: Time needed for Vout to reach 90% of final value

TS9007 Datasheet(PDF) 2 Page - Taiwan Semiconductor Company, Ltd

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