TSL2550

AMBIENT LIGHT SENSOR

WITH SMBus INTERFACE

TAOS029L − OCTOBER 2007

13

The LUMENOLOGY r Company

r

r

Copyright E 2007, TAOS Inc.

www.taosinc.com

MECHANICAL DATA

PACKAGE D

Plastic Small-Outline

PIN 1

6

0.510

0.330

8

y

j 2.8 TYP

CLEAR WINDOW

NOTE B

A

1.75

1.35

0.50

0.25

4.00

3.80

6.20

5.80

455

0.88 TYP TOP OF

SENSOR DIE

5.00

4.80

5.3

MAX

1.27

0.41

0.25

0.10

0.25

0.19

DETAIL A

TOP VIEW

END VIEW

SIDE VIEW

PIN 1

BOTTOM VIEW

Pb

NOTES: A. All linear dimensions are in millimeters.

B. The center of the 1234 μm by 282 μm photo-active area is typically located in the center of the package in the long dimension and

269 μm off center in the short dimension.

C. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

D. This drawing is subject to change without notice.

Figure 10. Package D — Plastic Small Outline IC Packaging Configuration