LMK6C datasheet(31/66 Pages) TI

31 / 66 page

9.4 Layout

9.4.1 Layout Guidelines

The following sections provide recommendations for board layout, solder reflow profile and power-supply

bypassing when using the LMK6x to provide good thermal and electrical performance and signal integrity of

the entire system.

9.4.1.1 Providing Thermal Reliability

The LMK6x is a high-performance device. Therefore, pay careful attention to device configuration and printed

circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground

plane of the PCB through three vias or more to maximize thermal dissipation out of the package.

Equation 1 describes the relationship between the PCB temperature around the LMK6x and the junction

temperature.

TB = TJ – ΨJB × P

(1)

where

• TB: PCB temperature around the LMK6x

• TJ: Junction temperature of LMK6x

• ΨJB: Junction-to-board thermal resistance parameter of LMK6x (refer to the Thermal Information tables in the

Specifications section for this information)

• P: On-chip power dissipation of LMK6x

9.4.1.2 Recommended Solder Reflow Profile

TI recommends following the recommendations provided by the solder paste supplier to optimize flux activity

and to achieve proper melting temperatures of the alloy within the guidelines of J-STD-20. Processing the

LMK6x with the lowest peak temperature possible is preferable while also remaining below the components

peak temperature rating as listed on the MSL label. The exact temperature profile depends on several factors

including maximum peak temperature for the component as rated on the MSL label, Board thickness, PCB

material type, PCB geometries, component locations, sizes, densities within PCB, as well solder manufactures

recommended profile, and capability of the reflow equipment to as confirmed by the SMT assembly operation.

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LMK6C, LMK6D, LMK6H, LMK6P

SNAS826E – APRIL 2022 – REVISED APRIL 2024

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LMK6C Datasheet(PDF) 31 Page - Texas Instruments