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MAS9188 Datasheet(PDF) 7 Page - Micro Analog systems |
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MAS9188 Datasheet(HTML) 7 Page - Micro Analog systems |
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7 / 10 page ![]() DA9188.002 23 February 2005 7 (10) SOLDERING INFORMATION ◆ For For Eutectic Sn/Pb TSSOP-20 Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 2*220 °C Maximum Temperature 240 °C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% ◆ For Green (Pb Free, RoHS Compliant) TSSOP-20 Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 Maximum Temperature 260 °C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Matte Tin EMBOSSED TAPE SPECIFICATIONS User Direction of Feed Pin1 W AO PO P2 P1 DO X X E F BO T KO Section X-X |
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