LLGA12

CASE 513AD−01

ISSUE A

DATE 22 FEB 2007

SCALE 4:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

D

E

B

C

0.15

PIN ONE

2X

REFERENCE

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

A

L

D2

E2

C

C

0.15

C

0.10

C

0.08

12X

A1

SEATING

PLANE

e

12X

NOTE 3

b

12X

0.10 C

0.05 C

A BB

DIM

MIN

MAX

MILLIMETERS

A

0.50

0.60

A1

0.00

0.05

b

0.20

0.30

D

3.00 BSC

D2

2.75

2.85

E

3.00 BSC

E2

1.65

1.75

e

0.50 BSC

K

0.20

−−−

L

0.35

0.45

1

6

12

7

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

12X

0.40

3.30

0.25

PITCH

1.73

0.56

2.78

1

K

12X

DIMENSIONS: MILLIMETERS

0.28

11X

A

= Assembly Location

L

= Wafer Lot

Y

= Year

W

= Work Week

G

= Pb−Free Package

(Note: Microdot may be in either location)

*This information is generic. Please refer to de-

vice data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “

G”,

may or may not be present.

GENERIC

MARKING DIAGRAM*

XXXXX

XXXXX

ALYW

G

G

1

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com

1

© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 0

Case Outline Number:

XXX

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

DESCRIPTION:

98AON22277D

ON SEMICONDUCTOR STANDARD

12 PIN LLGA, 3 X 3 X 0.5P, 0.55T

Electronic

versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

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