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AM263P4 Datasheet(PDF) 87 Page - Texas Instruments |
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AM263P4 Datasheet(HTML) 87 Page - Texas Instruments |
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87 / 164 page ![]() 6.10 Thermal Resistance Characteristics This section provides the thermal resistance characteristics used on this device. For reliability and operability concerns, the maximum junction temperature of the device has to be at or below the TJ value identified in Section 6.5, Recommended Operating Conditions. 6.10.1 Package Thermal Characteristics It is recommended to perform thermal simulations at the system level with the worst-case device power consumption. PARAMETER DESCRIPTION ℃/W(1) (2) AIR FLOW (m/s) (3) RΘJC Junction-to-case 5.4 N/A RΘJB Junction-to-board 5.3 N/A RΘJA Junction-to-free air 18.7 0 RΘJA Junction-to-moving air 12.4 1 11.2 2 10.6 3 ΨJT Junction-to-package top 0.12 0 0.35 1 0.47 2 0.56 3 ΨJB Junction-to-board 5.1 0 4.6 1 4.6 2 4.5 3 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Packages (2) ℃/W = degrees Celsius per watt (3) m/s = meters per second www.ti.com AM263P4, AM263P2, AM263P1, AM263P4-Q1, AM263P2-Q1, AM263P1-Q1 SPRSP81C – OCTOBER 2023 – REVISED MAY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 87 Product Folder Links: AM263P4 AM263P2 AM263P1 AM263P4-Q1 AM263P2-Q1 AM263P1-Q1 |
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