AM263P4 datasheet(157/164 Pages) TI

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9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

Changes from March 16, 2024 to April 25, 2024 (from Revision B (March 2024) to Revision C

(May 2024))

Page

• Title: Changed title of device from "AM263Px Sitara™ Microcontrollers" to "AM263Px Sitara™

Microcontrollers with Optional Flash-in-Package".......................................................................................... 0

• (Features): Updated formatting in Memory, Industrial Connectivity, High Speed Interfaces, Security, and

Technology / Package sections........................................................................................................................1

• (Features): Added information on Timer modules and package specific options...............................................1

• (Functional Block Diagram): Updated Functional Block Diagram to improve readability and clarity.................. 5

• (Device Comparison): Added Automotive GPN's to column headers.................................................................6

• (Device Comparison): Combined MCAN and CAN-FD rows..............................................................................6

• (Device Comparison): Updated JTAG ID section to list DEVICE_ID (Base Part Number) values instead of full

JTAG ID's............................................................................................................................................................6

• (Device Comparison): Updated Arm® Cortex-R5F row to include Lockstep information....................................6

• (Device Comparison): Updated table notes to reflect ZCZ-F Package options..................................................6

• (Device Identification): AM263Px Device Part Number Identifier table added................................................... 8

• (Related Products): Updated "Products to complete your design" section.........................................................9

• (Power Consumption Summary): Added in Power Consumption - Typical and Power Consumption - Traction

Inverter tables...................................................................................................................................................77

• (Electrical Characteristics): Added values for Input Leakage Current for ADC, ADC_R, CMPSSA, and

CMPSSB tables................................................................................................................................................78

• (Safety Comparators): Added "Vref Monitor (ROK2)" line item to Safety Comparators table.......................... 78

• (Safety System): Added Safety System table...................................................................................................78

• (Package Thermal Characteristics): Added values for moving air parameters................................................ 87

• (Peripheral Timings ePWM): Added MEP values for EPWM Characteristics table........................................ 102

• (Peripheral Timing OSPI): Added information and values for OSPI PHY External Loopback mode timing and

switching characteristics.................................................................................................................................122

Changes from January 8, 2024 to March 15, 2024 (from Revision A (January 2024) to Revision

B (March 2024))

Page

• Global: Added in pin and signal information for ZCZ-F package.......................................................................1

• (Features): Added information on OSPI Flash device for ZCZ-F package.........................................................1

• (Device Comparison): Added JTAG Device ID's................................................................................................ 6

• (Related Products): Added reference to AM263P SDK......................................................................................9

• Pin Attributes: Changed crystal power reference from "VDDS_OSC" to "VDDA18_OSC_PLL"......................16

• (OSPI Connections for Flash-in-Package (ZCZ_F)): Added applications chapter covering ZCZ_F OSPI

connections.....................................................................................................................................................150

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AM263P4, AM263P2, AM263P1, AM263P4-Q1, AM263P2-Q1, AM263P1-Q1

SPRSP81C – OCTOBER 2023 – REVISED MAY 2024

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Product Folder Links: AM263P4 AM263P2 AM263P1 AM263P4-Q1 AM263P2-Q1 AM263P1-Q1

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