TMP112 datasheet(31/44 Pages) TI

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10 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

10.1 Device Support

10.2 Documentation Support

10.2.1 Related Documentation

For related documentation see the following:

• Texas Instruments, TMP102 Low-Power Digital Temperature Sensor With SMBus and Two-Wire Serial

Interface in SOT563, data sheet

• Texas Instruments, TMP110 Ultra-Small, ±1.0°C Accurate, I2C Digital Temperature Sensor for CostSensitive

System, data sheet

• Texas Instruments, TMP112x High-Accuracy, Low-Power, Digital Temperature Sensors With SMBus and

TwoWire Serial Interface in SOT563, data sheet

• Texas Instruments, TMP113 Evaluation Module, EVM

10.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

10.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE

REVISION

NOTES

December 2024

Initial Release

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

TMP113

SBOSAJ5 – DECEMBER 2024

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