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THERMAL CHARACTERISTICS

TYPICAL CHARACTERISTIC CURVES

0

5

10

15

20

25

30

35

0

25

50

75

100

125

150

V

=3.3V,

V

=3.3V,

TA =25 C,

Load=15pF,

AllChannels

CC1

CC2

°

I

CC1

I

CC2

SignalingRate-Mbps

0

5

10

15

20

25

30

35

40

45

0

25

50

75

100

125

150

SignalingRate-Mbps

V

=5V,

V

=5V,

TA =25 C,

Load=15pF,

AllChannels

CC1

CC2

°

I

CC2

I

CC1

ISO7240

ISO7241

ISO7242

SLLS868 – SEPTEMBER 2007

UL

File Number: E181974

(1)

Production tested

≥ 3000 VRMS for 1 second in accordance with UL

1577.

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

Junction-to-air

°C/W

High-K Thermal Resistance

96.1

Junction-to-Board Thermal Resistance

61

°C/W

Junction-to-Case Thermal Resistance

48

°C/W

Device Power Dissipation

220

mW

Input a 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

3.3-V RMS SUPPLY CURRENT

5-V RMS SUPPLY CURRENT

vs

vs

SIGNALING RATE

SIGNALING RATE

Figure 6.

Figure 7.

16

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