Pad Assignment

Chip size: 129

* The IC substrate should be connected to VDD in the PCB layout artwork.

Pad Coordinates

Unit: mil

Pin No.

X

Y

Pin No.

X

Y

1

-58.61

18.57

18

58.82

0.51

2

-58.61

6.16

19

58.82

8.24

3

-58.61

-1.49

20

58.82

15.90

4

-58.61

-13.30

21

58.82

23.63

5

-58.61

-20.95

22

58.82

31.28

6

-58.61

-33.02

23

58.82

39.01

7

-58.61

-40.08

24

58.82

46.67

8

-57.25

-53.63

25

46.24

54.06

9

-50.62

-53.63

26

38.59

54.06

10

-43.99

-53.63

27

31.96

54.06

11

-37.36

-53.63

28

24.82

54.06

12

-15.64

-53.34

29

7.39

54.06

13

-3.19

-53.34

30

-0.43

53.29

14

7.44

-52.66

31

-14.28

53.29

15

26.05

-52.66

32

-23.63

53.29

16

58.48

-48.75

33

-42.33

53.29

17

58.82

-7.14

HT7500

Rev. 1.10

2

November 27, 2001

1

1 8

2

1 9

3

2 0

4

2 1

5

2 2

6

2 3

7

2 4

8

2 5

9

2 6

1 0

2 7

1 1

2 8

1 2

2 9

1 3

3 0

1 4

3 1

1 5

3 2

1 6

3 3

1 7

L O W C

V S S

S C

R .

R S

V D D

P S W

S A 1

S A 2

S A 3

S B 1

S B 2

S B 3

S C 1

S C 2

( 0 , 0 )