TPS65800RTQR datasheet(2/98 Pages) TI

2 / 98 page

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DESCRIPTION

TPS65800

SLVS606C – SEPTEMBER 2005 – REVISED FEBRUARY 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

The TPS65800 provides an easy to use, fully integrated solution for handheld devices, integrating charge

management, multiple regulated power supplies, system management and display functions, in a small

thermally-enhanced 8x8-mm package. The high level of integration enables typical board area space savings of

70% when compared to equivalent discrete solutions, while implementing a high-performance and flexible

solution, portable across multiple platforms. If required, an external host may control the TPS65800 via I2C

interface, with access to all integrated systems. The I2C enables setting output voltages, current thresholds, and

operation modes. Internal registers have a complete set of status information, enabling easy diagnostics, and

host-controlled handling of fault conditions. The TPS65800 can operate in stand-alone mode, with no external

host control, if the internal power-up defaults are compatible with the system requirements

AVAILABLE OPTIONS(1)

DEVICES(2)(3)(4)

MARKING

–40

°C to 125°C

TPS65800RTQ

TPS65800

(1)

For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI Web site at www.ti.com.

(2)

The RTQ package is available in tape and reel. Add R suffix (TPS65800RTQR) to order quantities of

2000 parts per reel. Add T suffix (TPS65800RTQT) to order quantities of 250 parts per reel.

(3)

This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total

product weight, and is suitable for use in specified lead-free soldering processes. In addition, this

product uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb)

above 0.1% of total product weight.

(4)

Other power-up sequences and default power-up states for the supplies can be implemented upon

request. Consult factory for available options.

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