www.lansdale.com

Page 9 of 9

Issue A

LANSDALE Semiconductor, Inc.

ML3356

P DIP 20 = RP

PLASTIC PACKAGE

(ML3356RP)

CASE 738–03

SO 20 = -6P

PLASTIC PACKAGE

(ML3356-6P)

CASE 751D–03

(SO–20L)

OUTLINE DIMENSIONS

0.050 BSC

0.100 BSC

0.300 BSC

1.27 BSC

2.54 BSC

7.62 BSC

MIN

MIN

MAX

MAX

MILLIMETERS

INCHES

DIM

25.66

6.10

3.81

0.39

1.27

0.21

2.80

0

°

0.51

27.17

6.60

4.57

0.55

1.77

0.38

3.55

15

°

1.01

1.010

0.240

0.150

0.015

0.050

0.008

0.110

0

°

0.020

1.070

0.260

0.180

0.022

0.070

0.015

0.140

15

°

0.040

A

B

C

D

E

F

G

J

K

L

M

N

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION “L” TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION “B” DOES NOT INCLUDE MOLD

FLASH.

5. 738–02 OBSOLETE, NEW STANDARD 738–03.

–A

–

C

K

N

E

GF

L

M

–T–

SEATING

PLANE

110

11

20

0.25 (0.010)

T

A

M

M

0.25 (0.010)

T

B

M

M

B

MIN

MIN

MAX

MAX

MILLIMETERS

INCHES

DIM

A

B

C

D

F

G

J

K

M

P

R

0.510

0.299

0.104

0.019

0.035

0.012

0.009

7

°

0.415

0.029

0.499

0.292

0.093

0.014

0.020

0.010

0.004

0

°

0.395

0.010

12.95

7.60

2.65

0.49

0.90

0.32

0.25

7

°

10.55

0.75

12.65

7.40

2.35

0.35

0.50

0.25

0.10

0

°

10.05

0.25

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

5. 751D–01, AND –02 OBSOLETE, NEW STANDARD

751D–03.

1.27 BSC

0.050 BSC

–A

–

–B

–

P

10 PL

1

10

11

20

G

–T–

K

C

SEATING

PLANE

R X 45

°

M

F

J

0.25 (0.010)

B

M

M

0.25 (0.010)

T

B

A

M

S

S

Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-

ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s

technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.