www.lansdale.com

Page 35 of 35

Issue A

Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-

ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. ÒTypical ” parameters which

may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s

technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.

ML1451xx

LANSDALE Semiconductor, Inc.

SOG 20 = -5P

SOG PACKAGE

CASE 751G–02

(ML145157-5P, ML145158-5P)

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

10.15

10.45

0.400

0.411

B

7.40

7.60

0.292

0.299

C

2.35

2.65

0.093

0.104

D

0.35

0.49

0.014

0.019

F

0.50

0.90

0.020

0.035

G

1.27 BSC

0.050 BSC

J

0.25

0.32

0.010

0.012

K

0.10

0.25

0.004

0.009

M

0°

7°

7°

0°

P

10.05

10.55

0.395

0.415

R

0.25

0.75

0.010

0.029

M

B

M

0.010 (0.25)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOW ABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

–A–

–B–

P

8X

G

14X

D

16X

SEATING

PLANE

–T–

S

A

M

0.010 (0.25)

T

16

9

8

1

F

J

M

C

K

OUTLINE DIMENSIONS