M41T94 datasheet(29/41 Pages) STMICROELECTRONICS

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M41T94

Maximum rating

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Maximum rating

Stressing the device above the rating listed in the “Absolute maximum ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the Operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Caution:

Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up

mode.

Caution:

Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

Table 10.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

TSTG

Storage temperature (VCC off, oscillator off)

SNAPHAT

–40 to 85

°C

SOIC

–55 to 125

°C

VCC

Supply voltage

–0.3 to 7

TSLD

(1)

For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal

budget not to exceed 245°C for greater than 30 seconds).

Lead solder temperature for 10 seconds

260

°C

VIO

Input or output Voltage

–0.3 to VCC+0.3

Output current

Power dissipation

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