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PARAMETER

SYMBOL

MIN

MAX

UNITS

DC Supply Voltage

VCC

2

6

V

DC Input or Output Voltage

VIN ,VOUT

0

VCC

V

Operating Temperature Range

TJ

-55

+125

°C

VCC = 2.0V

0

1000

VCC = 4.5V

0

500

Input Rise and Fall Times

(Figure 2)

VCC = 6.0V

tr, tf

0

400

ns

Recommended Operating Conditions (Voltages referenced to GND)

Absolute Maximum Ratings1

PARAMETER

SYMBOL

VALUE

UNIT

DC Supply Voltage (Referenced to GND)

VCC

-0.5 to +7.0

V

DC Input Voltage (Referenced to GND)

VIN

-0.5 to VCC +0.5

V

DC Output Voltage

VOUT

-0.5 to VCC +0.5

V

DC Input Current, per pad

IIN

±20

mA

DC Output Current, per pad

IOUT

±25

mA

DC VCC or GND Current, per pad

ICC

±50

mA

Power Dissipation in Still Air

2

PD

750

mW

Storage Temperature Range

TSTG

-65 to 150

°C

High Speed CMOS Logic – 54HC138

Rev 1.0

23/11/17

Logic Diagram

1.  Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may

reduce device reliability. 2. Measured in plastic DIP package, results in die form are dependent on die attach and assembly method.

PIN 14 = VCC

PIN 7 = GND

Pad Descriptions

ADDRESS INPUTS

A0, A1, A2 (Pads 1, 2, 3)

Address inputs. These inputs, when the chip is selected,

determine which of the eight outputs is active–low.

 

CONTROL INPUTS

CS1, CS2, CS3 (Pads 6, 4, 5)

Chip select inputs. For CS1 at a high level and CS2, CS3

at a low level, the chip is selected and the outputs follow

the Address inputs. For any other combination of CS1,

CS2, and CS3, the outputs are at a logic high.

OUTPUTS

Y0 – Y7 (Pads 15, 14, 13, 12, 11, 10, 9, 7)

Active–low Decoded outputs. These outputs assume a

low level when addressed and the chip is selected. These

outputs remain high when not addressed or the chip is not

selected.