High Speed CMOS Logic – 54HC14

 

Hex Schmitt-Trigger Inverter Logic IC in bare die form

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Die Size (Unsawn)

1250 x 1250

49 x 49

µm

mils

Minimum Bond Pad Size

100 x 100

3.94 x 3.94

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Output Drive Capability: 10 LSTTL Loads

Low Input Current: 1µA

Outputs directly interface CMOS, NMOS and TTL

Operating Voltage Range: 2V to 6V

CMOS High Noise Immunity

Function compatible with 54LS14

Full Military Temperature Range.

Rev 1.0

24/11/17

Features:

Ordering Information

Description

The 54HC14 Hex Schmitt-Trigger Inverter is fabricated

using a 2.5µm 5V CMOS process with the same high speed

performance of LSTTL combined with CMOS low power

consumption. The device performs the Boolean function Y

= Ᾱ in positive logic. Device inputs are compatible with

Standard CMOS outputs; with pull-up resistors, they are

compatible with LSTTL outputs. Schmitt-Trigger inputs

transform slow input rise and fall times into sharply defined

jitter-free output signals. Due to the hysteresis voltage of

the Schmitt trigger, the 54HC14 is useful in noisy

environments.

Die Dimensions in µm (mils)

The following part suffixes apply:

1250 (49)

No suffix - MIL-STD-883 /2010B Visual Inspection

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (400 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

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