Low Power Schottky Logic – 54LS138

Rev 1.0

21/11/17

3-to-8 Line Decoder / Demultiplexer IC in bare die form

 

Die Size (Unsawn)

1660 x 1650

65 x 65

µm

mils

Minimum Bond Pad Size

116 x 116

4.57 x 4.57

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Demultiplexing capability

Multiple Input Enables for parallel expansion

Active Low Mutually Exclusive Outputs

Input Clamp Diodes Limit High Speed Termination

Effects

Full Military Temperature Range.

Direct drop-in replacement for obsolete

components in long term programs.

Features:

The following part suffixes apply:

No suffix - MIL-STD-883 /2010B Visual Inspection

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

The 54LS138 3-to-8 Line Decoder / Demultiplexer is

fabricated on a 2µm 40V Bipolar process. The device

decodes 1-of-8 lines, set by x3 binary select inputs &

three enable inputs. Multiple Input Enables allow

parallel expansion to a 24-line decoder using x3

54LS138 devices or a 32 line decoder using x4

54LS138 + inverter. The LS138 can be used as an 8-

output demultiplexer by using one active LOW Enable

input as data input & the other Enable inputs as strobes.

Unused Enable inputs must be permanently tied to their

appropriate active HIGH or active LOW state.

Ordering Information

Description

Die Dimensions in µm (mils)

1660 (65)

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (100 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

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