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CPC1786 Datasheet(PDF) 1 Page - Clare, Inc.

Part # CPC1786
Description  i4-PAC??DC Power Relay
PDF  6 Pages
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Manufacturer  CLARE [Clare, Inc.]
Direct Link  http://www.clare.com
Logo CLARE - Clare, Inc.

CPC1786 Datasheet(HTML) 1 Page - Clare, Inc.

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www.clare.com
DS-CPC1786-R02
1
CPC1786
i4-PAC™ DC Power Relay
e3
RoHS
2002/95/EC
Part #
Description
CPC1786J
i4-PAC™ (25 per tube)
Applications
Features
Description
Ordering Information
Pin Configuration
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
• 100% Solid State
• Compact i4-PAC™ Power Package
• Low Thermal Resistance (0.35°C/W)
• 1.75A
DC Load Current with 5ºC/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• No Moving Parts
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• 2500V
rms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of High Power Solid State Relays. As part of
this new family, the CPC1786 single pole normally
open (1-Form-A) DC Solid State Relay employs
optically coupled MOSFET technology to provide
2500V
rms of input to output isolation.
The output is constructed with an efficient MOSFET
switch and photovoltaic die that uses Clare’s patented
OptoMOS architecture while the input GaAlAs
infrared LED provides the optically coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high-performance DC switching
applications.
The unique i4-PAC package pioneered by IXYS
allows solid state relays to achieve the highest load
current and power ratings. This package features
an IXYS unique process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500V
rms isolation but also
very low thermal resistance (0.35°C/W).
12
3
4
+-
-
+
Switching Characteristics of
Normally Open (Form A) Devices
CONTROL
I
LOAD
10%
90%
TON
TOFF
+
+
Parameter
Rating
Units
Blocking Voltage
1000
V
P
Load Current, T
A=25ºC
With 5ºC/W Heat Sink
1.75
A
DC
No Heat Sink
0.65
On-Resistance
2
Ω
RθJC
0.35
ºC/W
Approvals
• UL recognized component: File # E69938
• Certified to UL 508


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