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CPC1978 Datasheet(PDF) 1 Page - Clare, Inc.

Part # CPC1978
Description  i4-PAC??Power Relay
PDF  6 Pages
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Manufacturer  CLARE [Clare, Inc.]
Direct Link  http://www.clare.com
Logo CLARE - Clare, Inc.

CPC1978 Datasheet(HTML) 1 Page - Clare, Inc.

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CPC1978
i4-PAC™ Power Relay
www.clare.com
DS-CPC1978-R04
1
e3
RoHS
2002/95/EC
Applications
Features
Description
Ordering Information
Parameter
Rating
Units
Blocking Voltage
800
V
P
Load Current, T
A=25ºC
A
rms
With 5°C/W Heat Sink
1.85
No Heat Sink
0.75
On-resistance
2.3
Ω
RθJC
0.35
°C/W
Pin Configuration
Part Number
Description
CPC1978J
i4-PAC 25 per tube
Switching Characteristics of
Normally Open (Form A) Devices
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of high power solid state relays.
As part of this family, the CPC1978 single pole
normally open (1-Form-A) solid state power relay is
rated for up to 1.85A
rms continuous load current with
a 5ºC/W heat sink.
The CPC1978 employs optically coupled MOSFET
technology to provide 2500V
rms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of
high performance switching applications.
The unique i4-PAC package pioneered by
IXYS allows solid state relays to achieve the highest
load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper
Bond (DCB) substrate instead of the traditional
copper leadframe. The DCB ceramic, the same
substrate used in high power modules, not only
provides 2500V
rms isolation but also very low thermal
resistance (0.35 °C/W).
Compact i4-PAC™ Power Package
Low Thermal Resistance (0.35 °C/W)
1.85A
rms Load Current with 5°C/W Heat Sink
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
2500V
rms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL recognized component: File # E69938
Certified to: UL 508
3
-
4
+
12
CONTROL
I
LOAD
10%
90%
TON
TOFF
+
+


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