PAGE . 1

STAD-JUN.25.2004

DATA SHEET

FEATURES

• Plastic package has Underwriters Laboratory

Flammability Classification 94V-O utilizing

Flame Retardant Epoxy Molding Compound.

• Exceeds environmental standards of MIL-S-19500/228

• Low power loss, high efficiency.

• Low forwrd voltge, high current capability

• High surge capacity.

• For use in low voltage,high frequency inverters

free wheeling , and polarlity protection applications.

• Pb free product are available : 99% Sn above can meet Rohs environment

substance directive request

SB820~SB8100

SCHOTTKY BARRIER RECTIFIERS

.196(5.00)

.054(1.39)

.038(0.96)

.419(10.66)

.139(3.55)

MIN

.163(4.16)

.045(1.15)

.019(0.50)

.025(0.65)MAX

.1(2.54)

.1(2.54)

.387(9.85)

Unit : inch (mm)

TO-220AC

VOLTAGE

20 to 100 Volts

CURRENT

8 Ampere

MECHANICALDATA

Case: TO-220AC full molded plastic package

Terminals: Lead solderable per MIL-STD-202G, Method 208

Polarity: As marked.

Mounting Position: Any

Weight: 0.08 ounces, 2.24grams.

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%

R

E

T

E

M

A

R

A

PL

O

B

M

Y

S0

2

8

B

S0

3

8

B

S0

4

8

B

S0

5

8

B

S0

6

8

B

S0

8

8

B

S0

0

1

8

B

SS

T

I

N

U

e

g

a

t

l

o

V

e

s

r

e

v

e

R

k

a

e

P

t

n

e

r

r

u

c

e

R

m

u

m

i

x

a

0

20

30

40

50

60

80

0

1V

e

g

a

t

l

o

V

S

M

R

m

u

m

i

x

a

4

11

28

25

32

46

50

7V

e

g

a

t

l

o

V

g

n

i

k

c

o

l

B

C

D

m

u

m

i

x

a

0

20

30

40

50

60

80

0

1V

)

m

m

5

.

9

(

"

5

7

3

.

t

n

e

r

r

u

C

d

r

a

w

r

o

F

e

g

a

r

e

v

A

m

u

m

i

x

a

M

T

t

a

h

t

g

n

e

l

d

a

e

lc

0

0

1

=

8A

-

e

n

i

s

f

l

a

h

e

l

g

n

i

s

s

m

3

.

8

:

t

n

e

r

r

u

C

e

g

r

u

S

d

r

a

w

r

o

F

k

a

e

P

)

d

o

h

t

e

m

C

E

D

E

J

(

d

a

o

l

d

e

t

a

r

n

o

d

e

s

o

p

m

i

r

e

p

u

s

e

v

a

w

0

5

1A

A

0

.

8

t

a

e

g

a

t

l

o

V

d

r

a

w

r

o

F

m

u

m

i

x

a

5

5

.

05

7

.

05

8

.

0V

5

2

=

A

T

t

n

e

r

r

u

C

e

s

r

e

v

e

R

C

D

m

u

m

i

x

a

M

0

0

1

=

A

T

e

g

a

t

l

o

V

g

n

i

k

c

o

l

B

C

D

d

e

t

a

R

t

a

5

.

0

0

5

A

m

c

n

a

t

s

i

s

e

R

l

a

m

r

e

h

T

l

a

c

i

p

y

Te

R

θ C

J6

O

W

/

C

g

n

a

R

e

r

u

t

a

r

e

p

m

e

T

n

o

i

t

c

n

u

J

g

n

i

t

a

r

e

p

5

2

1

+

o

t

0

5

-

g

n

a

R

e

r

u

t

a

r

e

p

m

e

T

e

g

a

r

o

t

0

5

1

+

o

t

0

5

-

NOTES:

Both Bonding and Chip structure are available.