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Die Size (Unsawn)

1450 x 1400

57 x 55

µm

mils

Minimum Bond Pad Size

140 x 140

5.5 x 5.5

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Bipolar TTL Logic – 5407

High Voltage Hex Buffer / Driver Logic IC in bare die form



High Sink-Current Capability: 30mA



High Voltage Open-Collector Driver



Minimum breakdown voltage: 30V



Input Clamp Diodes minimize transmission-line effects



TTL compatible inputs



Direct drop-in replacement for obsolete components in

long term programs.

Rev 1.0

29/07/20

Features:

Ordering Information

The following part suffixes apply:



No suffix - MIL-STD-883 /2010B Visual Inspection



“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT



“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (400 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Ceramic Package – On request

Description

Die Dimensions in µm (mils)

1450 (57)

The 5407 comprises x6 buffer/drivers with high voltage

open-collector outputs. The device finds use as high-level

circuit interface or for driving high-current loads and is also

characterised to drive TTL inputs as buffer. The device has

a 30V minimum breakdown voltage and 30mA maximum

sink current.