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High Speed CMOS Logic – 74HC14

Rev 1.0

24/11/17

PARAMETER

SYMBOL

MIN

MAX

UNITS

Supply Voltage

VCC

2

6

V

DC Input or Output Voltage

VIN ,VOUT

0

VCC

V

Operating Temperature Range

TJ

0

+85

°C

VCC = 2.0V

VCC = 4.5V

Input Rise or Fall Times

tr, tf

VCC = 6.0V

-

No limit*

ns

* When VIN = 50% VCC, ICC > 1mA.

Recommended Operating Conditions3 (Voltages Referenced to GND)

Absolute Maximum Ratings1

PARAMETER

SYMBOL

VALUE

UNIT

DC Supply Voltage (Referenced to GND)

VCC

-0.5 to +7.0

V

DC Input Voltage (Referenced to GND)

VIN

-0.5 to VCC +0.5

V

DC Output Voltage (Referenced to GND)

VOUT

-0.5 to VCC +0.5

V

DC Input Current

IIN

±20

mA

DC Output Current, per pad

IOUT

±25

mA

DC Supply Current, VCC or GND, per pad

ICC

±50

mA

Power Dissipation in Still Air

2

PD

750

mW

Storage Temperature Range

TSTG

-65 to 150

°C

3.  This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken

to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be

constrained to the range GND ≤ (VIN or VOUT) ≤ VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).

Unused outputs must be left open.

LIMITS

PARAMETER

SYMBOL

VCC

CONDITIONS

25°C

85°C

FULL RANGE

4

UNITS

2.0V

1.50

1.50

1.50

3.0V

2.15

2.15

2.15

4.5V

3.15

3.15

3.15

Maximum Positive-

Going Input

Threshold Voltage

VT+ MAX

6.0V

VOUT = 0.1V

│IOUT│≤ 20µA

4.20

4.20

4.20

V

2.0V

1.0

0.95

0.95

3.0V

1.5

1.45

1.45

4.5V

2.3

2.25

2.25

Minimum Positive-

Going Input

Threshold Voltage

VT+ MIN

6.0V

VOUT = 0.1V

│IOUT│≤ 20µA

3.0

2.95

2.95

V

2.0V

0.9

0.95

0.95

3.0V

1.4

1.45

1.45

4.5V

2.0

2.05

2.05

Maximum

Negative-Going

Input Threshold

Voltage

VT- MAX

6.0V

VOUT = VCC -0.1V

│IOUT│≤ 20µA

2.6

2.65

2.65

V

DC Electrical Characteristics (Voltages referenced to GND)

1.  Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may

reduce device reliability. 2. Measured in plastic DIP package, results in die form are dependent on die attach and assembly method.