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Dual MOSFET Driver – SiS17601

Rev 1.0

29/01/20

COORDINATES

(µm)

PAD

FUNCTION

X

Y

1

EN A

-816

725

2

IN A

-816

434

3

GND

-816

139

4

GND

-816

-110

5

GND

-816

-363

6

IN B

-816

-673

7

OUT B

816

-783

8

OUT B

816

-611

9

VCC

816

-300

10

VCC

816

107

11

OUT A

816

450

12

OUT A

816

629

13

EN B

622

844

ISOLATE CHIP BACKSIDE

Pad Layout and Functions

2080µm (81.89 mils)

PADS

SYMBOL

DESCRIPTION

1

EN A

Enable Input for Driver A. Internally pulled to VCC through a 100kΩ

resistor. Leave unconnected for always-on operation. Connect to

GND for disabling the corresponding channel.

2

IN A

Logic Input for Channel A

3, 4, 5

GND

Ground

6

IN B

Logic Input for Channel B

7, 8

OUT B

Channel B Driver Output. Sources and sinks current for channel B

to turn the external MOSFET at OUT B on or off.

9, 10

VCC

Power-Supply Input. Bypass to GND with one or more low ESR

0.1µF ceramic capacitors.

11, 12

OUT A

Channel A Driver Output. Sources and sinks current for channel A

to turn the external MOSFET at OUTA on or off.

13

EN B

Enable Input for Driver B. Internally pulled to VCC through a 100kΩ

resistor. Leave unconnected for always-on operation. Connect to

GND for disabling the corresponding channel.

 

Typical Circuit

1

4

2

3

5

6

13

12

11

10

9

8

7

DIE ID

Pad Descriptions

0,0