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PACKING LIST

ORDERING INFORMATION

Model Name

P/N

Processor

Memory

UFS

Display

Power

Operating Temp.

QRB812BC82-5165

TBD

Qualcomm QRB5165

8GB

128GB

MIPI- DSI + USB-C DP

5VDC

-5°C~65°C

1 QRB812 module

DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your

sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © September 29, 2024 DFI Inc.

SPECIFICATION

SYSTEM

Processor

QRB5165, Kryo 585 2.84Ghz

- Quad high-performance Kryo Gold cores

• Three Kryo Gold cores with a 256 KB L2 cache per core, Fmax at 2.419 GHz

• One Kryo Gold prime core with a 512 KB L2 cache, Fmax at 2.842 GHz

- Quad low-power Kryo Silver cores with a 128 KB L2 cache per core, Fmax at 1.805 GHz

Memory

PoP LPDDR5, 8GB memory down

GRAPHICS

Controller

Adreno 650 GPU

Feature

Open GL ES 3.2, Vulkan 1.1, DX12 FL 12_1, OpenCL 2.0

Display

1 x 4-lane MIPI-DSI (to HDMI on carrier board)

1 x DP 1.4 (thru USB Type-C on carrier board)

I/O

Interface

2 x PCIe x2 (Gen3)

1 x PCIe x1 (Gen3)

2 x I2C

2 x SPI

4 x PWM

2 x UART(TX/RX/RTS/CTS)

2 x UART(TX/RX)

1 x UART(console)

1 x 4-bit SDIO

6 x 4-lane MIPI-CSI

2 x USB 3.1 Gen 2 (USB0 for Download or USB Type-C)

16 x GPIO

STORAGE

UFS

128GB UFS 3.1

SECURITY

TEE

Qualcomm® Trusted Execution Environment v5

POWER

Type

5VDC

Consumption

TBD

OS SUPPORT

Linux

Ubuntu

ENVIRONMENT

Temperature

Operating: -5°C~65°C

Storage: -40°C~85°C

Humidity

Operating: 10%~90% RH

Storage: 10%~90% RH

MTBF

TBD

MECHANICAL

Form Factor

OSM 1.1

(*Please be advised that certain pins do not adhere OSM standards. For further details, kindly

refer to the user manual.)

Dimensions

45 mm (1.77") x 45 mm (1.77")

STANDARDS AND

CERTIFICATIONS

Certification

CE, FCC, RoHS